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 CY7C106BN CY7C1006BN
256K x 4 Static RAM
Features
* High speed -- tAA = 15 ns * CMOS for optimum speed/power * Low active power -- 495 mW * Low standby power -- 275 mW * 2.0V data retention (optional) * Automatic power-down when deselected * TTL-compatible inputs and outputs
Functional Description
The CY7C106BN and CY7C1006BN are high-performance CMOS static RAMs organized as 262,144 words by 4 bits. Easy memory expansion is provided by an active LOW Chip Enable (CE), an active LOW Output Enable (OE), and three-state drivers. These devices have an automatic power-down feature that reduces power consumption by more than 65% when the devices are deselected. Writing to the devices is accomplished by taking Chip Enable (CE) and Write Enable (WE) inputs LOW. Data on the four I/O pins (I/O0 through I/O3) is then written into the location specified on the address pins (A0 through A17). Reading from the devices is accomplished by taking Chip Enable (CE) and Output Enable (OE) LOW while forcing Write Enable (WE) HIGH. Under these conditions, the contents of the memory location specified by the address pins will appear on the four I/O pins. The four input/output pins (I/O0 through I/O3) are placed in a high-impedance state when the devices are deselected (CE HIGH), the outputs are disabled (OE HIGH), or during a write operation (CE and WE LOW). The CY7C106BN is available in a standard 400-mil-wide SOJ; the CY7C1006BN is available in a standard 300-mil-wide SOJ.
Logic Block Diagram
Pin Configuration
SOJ Top View A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 CE OE GND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15
INPUT BUFFER
A1 A2 A3 A4 A5 A6 A7 A8 A9
ROW DECODER
SENSE AMPS
I/O3 I/O2 I/O1 I/O0
VCC A17 A16 A15 A14 A13 A12 A11 NC I/O3 I/O2 I/O1 I/O0 WE
512 x 512 x 4 ARRAY
COLUMN DECODER
POWER DOWN
CE WE
A10 A11 A12 A13 A14 A15 A16 A17
A0
OE
Cypress Semiconductor Corporation Document #: 001-06429 Rev. **
*
198 Champion Court
*
San Jose, CA 95134-1709 * 408-943-2600 Revised February 1, 2006
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CY7C106BN CY7C1006BN
Selection Guide
7C106BN-15 7C1006BN-15 Maximum Access Time (ns) Maximum Operating Current (mA) Maximum Standby Current (mA) 15 80 30 7C106BN-20 7C1006BN-20 20 75 30
Maximum Ratings
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ................................-65xC to +150xC Ambient Temperature with Power Applied............................................-55xC to +125xC Supply Voltage on VCC Relative to GND[1] .... -0.5V to +7.0V DC Voltage Applied to Outputs in High Z State[1] ....................................-0.5V to VCC + 0.5V DC Input Voltage[1] .................................-0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA Static Discharge Voltage ........................................... >2001V (per MIL-STD-883, Method 3015) Latch-Up Current ..................................................... >200 mA
Operating Range
Range Commercial Industrial Ambient Temperature[2] 0C to +70C -45C to +85C VCC 5V 10%
Electrical Characteristics Over the Operating Range
7C106BN-15 7C1006BN-15 Parameter VOH VOL VIH VIL IIX IOZ IOS ICC ISB1 ISB2 Description Output HIGH Voltage Output LOW Voltage Input HIGH Voltage Input LOW Voltage[1] Input Leakage Current Output Leakage Current Output Short Circuit Current[3] VCC Operating Supply Current Automatic CE Power-Down Current --TTL Inputs Automatic CE Power-Down Current --CMOS Inputs GND < VI < VCC GND < VI < VCC, Output Disabled VCC = Max., VOUT = GND VCC = Max., IOUT = 0 mA, f = fMAX = 1/tRC Max. VCC, CE > VIH, VIN > VIH or VIN < VIL, f = fMAX Max. VCC, CE > VCC - 0.3V, VIN > VCC - 0.3V or VIN < 0.3V, f=0 Com'l Test Conditions VCC = Min., IOH = -4.0 mA VCC = Min., IOL = 8.0 mA 2.2 -0.3 -1 -5 Min. 2.4 0.4 VCC + 0.3 0.8 +1 +5 -300 80 30 10 2.2 -0.3 -1 -5 Max. 7C106BN-20 7C1006BN-20 Min. 2.4 0.4 VCC + 0.3 0.8 +1 +5 -300 75 30 10 Max. Unit V V V V mA mA mA mA mA mA
Capacitance[4]
Parameter CIN: Addresses CIN: Controls COUT Description Input Capacitance Output Capacitance Test Conditions TA = 25xC, f = 1 MHz, VCC = 5.0V Max. 7 10 10 Unit pF pF pF
Notes: 1. VIL (min.) = -2.0V for pulse durations of less than 20 ns. 2. TA is the "instant on" case temperature. 3. Not more than 1 output should be shorted at one time. Duration of the short circuit should not exceed 30 seconds. 4. Tested initially and after any design or process changes that may affect these parameters.
Document #: 001-06429 Rev. **
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CY7C106BN CY7C1006BN
AC Test Loads and Waveforms
R1 480 5V OUTPUT 30 pF INCLUDING JIG AND SCOPE R2 255 5V OUTPUT 5 pF INCLUDING JIG AND SCOPE R2 GND 255
Rise Time < 1V/ns
R1 480 3.0V
ALL INPUT PULSES 90% 10% 90% 10%
Fall Time < 1V/ns
(a)
Equivalent to: OUTPUT THEVENIN EQUIVALENT 167 1.73V
(b)
Switching Characteristics Over the Operating Range[5]
7C106B-15 7C1006B-15 Parameter READ CYCLE tRC tAA tOHA tACE tDOE tLZOE tHZOE tLZCE tHZCE tPU tPD tWC tSCE tAW tHA tSA tPWE tSD tHD tLZWE tHZWE Read Cycle Time Address to Data Valid Data Hold from Address Change CE LOW to Data Valid OE LOW to Data Valid OE LOW to Low Z OE HIGH to High Z[6, 7] CE LOW to Low Z[7] CE HIGH to High Z[6, 7] CE LOW to Power-Up CE HIGH to Power-Down Write Cycle Time CE LOW to Write End Address Set-Up to Write End Address Hold from Write End Address Set-Up to Write Start WE Pulse Width Data Set-Up to Write End Data Hold from Write End WE HIGH to Low WE LOW to High Z[7] Z[6, 7] 15 12 12 0 0 12 8 0 3 7 0 15 20 15 15 0 0 15 10 0 3 8 3 7 0 20 0 7 3 8 3 15 7 0 8 15 15 3 20 8 20 20 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Description Min. Max. 7C106B-20 7C1006B-20 Min. Max. Unit
WRITE CYCLE[8, 9]
Notes: 5. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance. 6. tHZOE, tHZCE, and tHZWE are specified with a load capacitance of 5 pF as in part (b) of AC Test Loads. Transition is measured 500 mV from steady-state voltage. 7. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device. 8. The internal write time of the memory is defined by the overlap of CE and WE LOW. CE and WE must be LOW to initiate a write, and the transition of either of these signals can terminate the write. The input data set-up and hold timing should be referenced to the leading edge of the signal that terminates the write. 9. The minimum write cycle time for Write Cycle No. 3 (WE controlled, OE LOW) is the sum of tHZWE and tSD.
Document #: 001-06429 Rev. **
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CY7C106BN CY7C1006BN
Data Retention Characteristics Over the Operating Range
Parameter VDR ICCDR tCDR tR
[4] [4]
Description VCC for Data Retention Data Retention Current Chip Deselect to Data Retention Time Operation Recovery Time
Conditions[10] VCC = VDR = 2.0V, CE > VCC - 0.3V, VIN > VCC - 0.3V or VIN < 0.3V
Min. 2.0
Max. 250
Unit V A ns ms
0 200
Data Retention Waveform
DATA RETENTION MODE VCC 4.5V tCDR CE VDR > 2V 4.5V tR
Switching Waveforms
Read Cycle No.1[11, 12] 1
tRC ADDRESS tOHA DATA OUT PREVIOUS DATA VALID tAA DATA VALID
Read Cycle No. 2 (OE Controlled)[12, 13]
ADDRESS tRC CE tACE OE tDOE tLZOE HIGH IMPEDANCE tLZCE VCC SUPPLY CURRENT tPU 50% tHZOE tHZCE DATA VALID tPD 50% ISB ICC HIGH IMPEDANCE
DATA OUT
Notes: 10. No input may exceed VCC +0.5V. 11. Device is continuously selected, OE and CE = VIL. 12. WE is HIGH for read cycle. 13. Address valid prior to or coincident with CE transition LOW.
Document #: 001-06429 Rev. **
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CY7C106BN CY7C1006BN
Switching Waveforms (continued) Write Cycle No. 1 (CE Controlled)[14, 15]
tWC ADDRESS tSCE CE tSA tAW tPWE WE tSD DATA I/O DATA VALID tHD tHA
Write Cycle No. 2 (WE Controlled, OE HIGH During Write)[14, 15]
tWC ADDRESS tSCE CE
tAW tSA WE tPWE
tHA
OE tSD DATA I/O tHZOE
Notes: 14. If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. 15. Data I/O is high impedance if OE = VIH.
tHD
DATA VALID
Document #: 001-06429 Rev. **
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CY7C106BN CY7C1006BN
Switching Waveforms (continued) Write Cycle No. 3 (WE Controlled, OE LOW)[9, 15]
tWC ADDRESS tSCE CE
tAW tSA WE tSD DATA I/O tHZWE DATA VALID tPWE
tHA
tHD
tLZWE
Truth Table
CE H L L L OE X L X H WE X H L H Input/Output High Z Data Out Data In High Z Power-Down Read Write Selected, Outputs Disabled Mode Power Standby (ISB) Active (ICC) Active (ICC) Active (ICC)
Ordering Information
Speed (ns) 15 20 Ordering Code CY7C106BN-15VC CY7C1006BN-15VC CY7C106BN-20VC Package Diagram 51-85032 51-85031 51-85032 Package Type 28-Lead (400-Mil) Molded SOJ 28-Lead (300-Mil) Molded SOJ 28-Lead (400-Mil) Molded SOJ Operating Range Commercial Commercial
Please contact local sales representative regarding availability of these parts.
Document #: 001-06429 Rev. **
Page 6 of 8
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CY7C106BN CY7C1006BN
Package Diagrams
28-pin (300-Mil) Molded SOJ (51-85031)
NOTE : 1. JEDEC STD REF MO088 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.006 in (0.152 mm) PER SIDE 3. DIMENSIONS IN INCHES MIN. MAX.
PIN 1 ID
14 1
DETAIL A EXTERNAL LEAD DESIGN
0.291 0.300
0.330 0.350 0.013 0.019
OPTION 1 OPTION 2
0.026 0.032 0.014 0.020
15
28
0.697 0.713 0.120 0.140 0.050 TYP.
SEATING PLANE
0.007 0.013
0.004
A
0.025 MIN.
0.262 0.272
51-85031-*C
28-Lead (400-Mil) Molded SOJ (51-85032)
PIN 1 I.D
14
1
.395 .405
.435 .445
DIMENSIONS IN INCHES
MIN. MAX.
15
28
.720 .730 SEATING PLANE .128 .148 .050 TYP. .015 .020 .026 .032
0.004
.007 .013 .360 .380
51-85032.*B
.025 MIN.
All product or company names mentioned in this document may be the trademarks of their respective holders. Document #: 001-06429 Rev. ** Page 7 of 8
(c) Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
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CY7C106BN CY7C1006BN
Document History Page
Document Title: CY7C106BN/CY7C1006BN 256K x 4 Static RAM Document Number: 001-06429 REV. ** ECN NO. 423847 Issue Date See ECN Orig. of Change NXR Description of Change New Data sheet
Document #: 001-06429 Rev. **
Page 8 of 8
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